Chipworks Analyze’s MS Xbox 360 Silicon

Source: d-silence
Mother_Board

Chipworks today announced that they have analysed the key chips of the new Microsoft Xbox 360 console and that detailed technical reports are ready for purchase immediately.

Chipworks monitors advanced semiconductors and systems, and creates detailed reports of what is inside technology. Their customers use this information to maintain their competitive advantage, benchmark their innovations and improve their business costs. To purchase an in-depth study of the key chips in the Xbox 360, contact [email protected].

Dick James, senior technology analyst, also commented: “Earlier press announcements revealed that the Xbox’s custom microprocessor was being fabbed by IBM, and the graphics processor was designed by ATI, both using 90-nm processes. Later, NEC announced that they were supplying the embedded DRAM to work with the ATI chip, and Infineon has also declared they will have parts in the console. ATI has used TSMC as a high performance foundry at the 130- and 110-nm process nodes, so we’re curious to see if the relationship has continued.”

“Most of the dedicated parts have the Microsoft X-logo on them, including the silicon die markings, not the design or IDM origin. We could call this ‘Microsoft inside’,” added Tomkins. “So far we have identified the IBM, ATI, and NEC parts, Samsung GDDR3 SDRAM, Hynix NAND flash, and other chips whose origin we are investigating.”

Chipworks also reports that the NEC embedded DRAM is co-packaged with the ATI processor, rather than being integrated into the same piece of silicon. This allows the processes to be optimised for the separate devices, without forcing a compromise to achieve what could be a false economy.

To see what’s inside the Xbox 360, click [here].

Source: d-silence
Mother_Board

Chipworks today announced that they have analysed the key chips of the new Microsoft Xbox 360 console and that detailed technical reports are ready for purchase immediately.

Chipworks monitors advanced semiconductors and systems, and creates detailed reports of what is inside technology. Their customers use this information to maintain their competitive advantage, benchmark their innovations and improve their business costs. To purchase an in-depth study of the key chips in the Xbox 360, contact [email protected].

Dick James, senior technology analyst, also commented: “Earlier press announcements revealed that the Xbox’s custom microprocessor was being fabbed by IBM, and the graphics processor was designed by ATI, both using 90-nm processes. Later, NEC announced that they were supplying the embedded DRAM to work with the ATI chip, and Infineon has also declared they will have parts in the console. ATI has used TSMC as a high performance foundry at the 130- and 110-nm process nodes, so we’re curious to see if the relationship has continued.”

“Most of the dedicated parts have the Microsoft X-logo on them, including the silicon die markings, not the design or IDM origin. We could call this ‘Microsoft inside’,” added Tomkins. “So far we have identified the IBM, ATI, and NEC parts, Samsung GDDR3 SDRAM, Hynix NAND flash, and other chips whose origin we are investigating.”

Chipworks also reports that the NEC embedded DRAM is co-packaged with the ATI processor, rather than being integrated into the same piece of silicon. This allows the processes to be optimised for the separate devices, without forcing a compromise to achieve what could be a false economy.

To see what’s inside the Xbox 360, click [here].

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